Packaging of Integrated Photonics: From Design to Production

Heinemann showcases state of the art design and execution of integrated photonic packages. He reports on technologies for high efficiency optical coupling between semiconductors and fiber array units (FAUs) or photonic integrated circuits (PICs) that include butt coupling, integrated spot size converters made by ion exchange, and nanoimprinted lenses that also enable surface coupling. Edge coupling and grating coupling are used in straight or angled configurations. The routing of electrical DC and RF drive current and sensitive RF sense currents must be laid out for minimal interference. Consistent high optical coupling efficiency of all optical channels is vital for performance.

Heinemann details design rules for packaging, leading to standardized packages making downstream testing and integration more streamline and cost effective. He also shares applications from remote sensing, quantum technology and bio sensing.

About the presenter
Stefan Heinemann, Ph.D., is vice president of sales for Phix U.S., North America. He joined from Aurora, where he led the team for opto-mechanical engineering of the Lidar product and packaging for next generation Lidar on chip both enabling coherent 4D detection up to 400 m. Before that, he led the development of a high-power diode laser product line and the technology development team at TRUMPF Photonics. Heinemann also served as the director at Fraunhofer USA, Center for Laser Technology, where he developed production technologies with light. He started his professional career at JENOPTIK in Jena, Germany. Heinemann co-founded four companies in the fields of lasers and renewable energy, holding positions as CEO and CTO.

He earned a degree in physics from the Technical University of Munich and a doctorate in electrical engineering from the Technical University of Berlin. He holds 68 patents and has more than 150 published works.