Multi-Chip Detector-Emitter Packages and Their Applications

The development and application of multi-chip detector-emitter packages offer innovative solutions for precise measurement in fields like medical diagnostics, environmental sensing, and industrial process control. These advanced optoelectronic packages integrate silicon, silicon carbide (SiC), and InGaAs photodiodes with UV, visible, and infrared LED emitters, creating compact, integrated solutions that can simultaneously detect and emit across multiple wavelengths. This capability enables applications such as spectroscopic analysis, noninvasive medical measurements, and the detection of gases and chemicals.

By combining multiple light sources and detectors in a single, compact package, these systems simplify design, reduce costs, and enhance overall performance. Incorporating transimpedance amplifiers (TIAs) to convert weak electrical signals into usable voltage and thermoelectric coolers (TECs) to regulate temperature ensures precise detection in various environments. Attendees will explore practical case studies that highlight the adaptability and effectiveness of these technologies across different sectors.

About the presenter
Vince Forte has served as the chief technology officer at Marktech Optoelectronics since its founding in 1985. With over 35 years of experience in the optoelectronics industry, he oversees research and development, custom design, and quality initiatives. Forte’s expertise in LED and photodetector technologies has driven advancements in LiDAR, medical equipment, industrial automation, and wearable technology.