September 17, 2025 Online. FREE Registration.
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Enabling Next-Generation Electronics with Intelligent Laser Processing

Presentation will begin: Wednesday, September 17, 2025 - 11:45 AM
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Enabling Next-Generation Electronics with Intelligent Laser Processing

Presented by: Mara Lisa Heinlein, SCANLAB GmbH

As modern electronic devices component density continues to increase and feature sizes decrease, the demand for ultra-precise and high-density structures grows exponentially. Typical applications where laser micromachining play a vital role are high density interconnects, through glass vias and drilling probe card structures for wafer-level testing. In all cases, structure geometries often fall below 100µm while requiring micrometer accuracy - pushing mechanical methods to their limits due to tool wear, deflection, and lack of flexibility.

To meet these challenges, ultrafast laser processes combined with advanced beam steering has become a cornerstone of next-generation manufacturing. This approach enables precise high-throughput processing and the ability to create complex geometries such as tapered or stepped holes.

The key to unlocking this performance lies in the combination of high-end scan systems and intelligent software tools. This ranges from 3.5 kHz single shot to 5-axis precession drilling. Software solutions complete the offering and may include sub-cycle switching for high-speed precision and offline simulation for reduced development time. This presentation will showcase how laser drilling applications with micrometer precision can benefit from modern scanning solutions.


About the presenter
Mara Lisa HeinleinMara Lisa Heinlein has been working in the field of laser technology for over eight years, combining deep technical expertise with a strong sense for market dynamics and customer needs. After earning her bachelor’s and master’s degrees in physics from LMU Munich, she joined SCANLAB in technical sales, where she developed a comprehensive understanding of the challenges associated with industrial laser applications.

For over three years, she has been shaping and driving market-oriented strategies as a product manager for high-precision laser processes such as drilling, cutting, and surface structuring. Her strength lies at the intersection of technology, market, and application—always with the aim of creating innovative and practical solutions. Outside of work, she brings the same passion and drive to her personal life, often found on a road bike or in the mountains, always motivated to push boundaries and keep evolving.




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