Scaling Next-Generation Optical Engines: Heterogeneous TFLN Integration on Low Loss PICs

Scaling photonic integration from prototype to industrial deployment has proven harder than the technology alone would suggest. This presentation argues that heterogeneous integration on a silicon nitride (SiN) platform offers a credible path forward, combining TFLN-based high-speed (>120 GHz) low-voltage modulation, high-speed photodetection, tunable and comb lasers, and efficient fiber-to-PIC interconnects on a low-loss waveguide core.

Geiselmann shows that this complexity is manufacturable at scale by transferring the process to a high-volume, automotive-qualified foundry environment, directly addressing the gap between photonic performance and industrial viability.

About the presenter
Michael Geiselmann, Ph.D., is president and CCO of LIGENTEC. He studied physics and engineering at the University of Stuttgart and École Centrale Paris and received his doctorate at the Institute of Photonic Sciences in Barcelona. In 2014, he joined the laboratory of Professor Tobias Kippenberg at the Swiss Federal Institute of Technology of Lausanne in Switzerland, where he advanced frequency comb generation on integrated silicon nitride chips and engaged in several international research projects. In 2016, Geiselmann co-founded LIGENTEC and brought the company to the international stage of photonic integration.