Sharpening Precision: Laser Beam Profiling for High-Accuracy Micromachining

This presentation offers a comprehensive and practical overview of laser beam profiling, emphasizing its critical role in high-precision micromachining applications. Laser beam profilers are essential tools that enable engineers and technicians to monitor, control, and optimize laser performance, directly impacting the quality and consistency of micromachined components. The session begins with foundational concepts in beam measurement, including the importance of spatial intensity distribution and temporal stability. It then explores various beam profiling techniques—such as knife-edge, slit scanning, and camera-based methods—highlighting their respective advantages and limitations.

Key parameters like beam diameter, divergence, and M² (beam quality factor) are discussed in detail, as they are vital for assessing beam focusability and energy distribution. Real-world case studies are presented to demonstrate how precise beam characterization leads to improved process reliability, reduced material waste, and enhanced throughput in industrial settings. Whether for research and development or production environments, understanding and applying beam profiling techniques is indispensable for achieving optimal results in micromachining workflows.

About the presenter
Logan Hatanaka, Ph.D., is a senior sales engineer at DataRay Inc, which specializes in the manufacturing and design of laser beam profiling systems. Hatanaka has extensive experience recommending and designing profiling systems, whether it be off-the-shelf options or fully custom solutions. He has a multidisciplinary background backed by Bachelor of Science and doctoral degrees in engineering from UCLA and Texas A&M University, with industrial experience ranging from process safety and design to photonics characterization. He is happy to leverage his wide-ranging engineering expertise to help find a profiling solution that best meets customers' needs.