Challenges in PIC Development

PIC-based applications like data center transceivers, LIDAR, quantum systems and biosensors are scaling up significantly, but several challenges have recently emerged in the back end. Besides packaging, there’s a building need for functional characterization for design and process validation, wafer- and die-level production testing to sort KGDs, and key reliability aspects for each market to assess long-term functionality and reduce failure rates. The main technical challenges will be discussed — tackling probing, instrumentation, and data processing aspects as well as business trends in the PIC testing landscape.

About the presenter
Miquel Minguillon is an application engineer at VLC Photonics, where he plays a pivotal role in supporting clients throughout the design and testing phases of photonic integrated circuits (PICs). He holds a master’s degree in materials science from Utrecht University and he is responsible for developing, maintaining, and expanding customer relationships, ensuring their needs are met with tailored and innovative solutions.

He actively supports sales activities by assisting in defining project requirements, selecting optimal technology platforms, and optimizing designs through advanced simulations. Additionally, he provides hands-on support to customers by leveraging VLC's state-of-the-art testing facilities, which enable high-speed signal analysis, eye-diagram measurements, and detailed component characterization.