From Photonic Interposers to Embedded Optical Interconnects: Solving The PIC Packaging Bottleneck

Flöry showcases innovative strategies to enhance the salability and cost-effectiveness of photonic chip packaging. Two key approaches are highlighted: the co-packaging of electrical and photonic integrated circuits (EICs and PICs) on a shared interposer substrate using advanced optical coupling techniques, such as evanescent surface coupling.

Additionally, the concept of the waveguide-embedded system (WES) is introduced. This technology integrates optical waveguides directly into printed circuit boards (PCBs), providing a high-performance, fiberless alternative to traditional co-packaged optics (CPO) for AI and HPC data centers. By eliminating the need for fiber optic cables within servers, WES delivers higher density and bandwidth, reduced loss and crosstalk, improved thermal management, and easier maintenance and repair.

Flöry also details the key components and assembly methods of both approaches, emphasizing their potential to transform photonic chip packaging and redefine data center architectures.

About the presenter
Nikolaus Flöry, Ph.D., is a business development manager at vario-optics, where he works on integrated photonics applications based on the company’s unique polymer waveguide platform. He holds a master’s degree in physics and a doctorate in optical sciences, both from ETH Zürich.