Breaking the CPO Manufacturing Bottleneck: Modular Connectivity and High-Speed Multichannel Active Alignment

The rapid scaling of AI-driven data centers is pushing traditional networking hardware beyond physical limits. To meet the demands for increased bandwidth and lower power-per-bit, the industry is transitioning toward Co-Packaged Optics (CPO).

While CPO offers significant performance advantages, it introduces substantial manufacturing challenges, particularly at the high-density optical interface. This webinar explores technical solutions to these scaling hurdles, focusing on the integration of modular connectivity and high-speed automated alignment.

The session is divided into two primary technical areas:

• Modular Detachable Connectivity and Expanded-Beam Interfaces: Roy will examine the transition from permanent fiber attachments to detachable optical interfaces at the chip level. Improving the modularity of these connectors is critical to facilitating high-volume testing and assembly of these devices, impacting yield, process flow, and serviceability.
• Multichannel 6-DOF Active Alignment and Optimization: Bressi will detail the technical requirements for aligning high-density optical arrays, which are sensitive to misalignments across all six degrees of freedom (6-DOF). This section will explore new approaches to solving the multichannel active alignment challenges facing the CPO ecosystem.

Join Roy and Bressi to evaluate how these advancements in optical interface design and automated motion control provide the precision and throughput necessary for the commercial deployment of next-generation CPO infrastructure.

About Justin Bressi
Justin Bressi is Aerotech’s business development manager for precision automation market segments, including semiconductor, photonics, optics, aerospace, R&D, and inspection systems. He has over 10 years of experience in precision motion systems and robotics, holding roles in applications engineering, field sales, and business development.

Bressi earned his bachelor's degree in mechanical engineering and his master’s degree in business administration from the University of Pittsburgh.

About Obie Roy
Obie Roy is director of global business development at SENKO Advanced Components' Emerging Technologies Group, where he leads initiatives focused on advancing silicon photonics and co-packaged optics (CPO) optical connectivity solutions for next-generation data center and AI infrastructure.

With over 25 years of experience, his work centers on the intersection of networking architectures and emerging optical technologies, with particular expertise in detachable optical connectivity to the photonic integrated circuit (PIC) in CPO systems