From Silicon to System: Streamlining Design in CPO Architectures with EPDA and 3DIC Workflows

As integrated photonics moves beyond device-level innovation toward system-level deployment, the industry is undergoing a fundamental shift in design complexity. Driven by the growth of AI infrastructure and increasing bandwidth demands, photonic integration now extends beyond individual components to encompass co-design between electronic ICs (EICs) and photonic ICs (PICs), as well as heterogeneous integration across multi-die co-packaged optics (CPO) architectures.

This presentation explores emerging design challenges across the silicon-to-system continuum, including the need for electronic-photonic design automation (EPDA) workflows that enable seamless design of individual photonic components, simulation of photonic integrated circuits, layout creation and implementation, and electro-optical co-simulation.

Furthermore, Chen will highlight the critical role of 3DIC design methodologies in managing heterogeneous integration. In CPO architecture, close physical proximity amplifies cross-domain coupling effects. Multiphysics analysis, encompassing signal and power integrity, thermal effects, and mechanical stress, is no longer optional but a fundamental requirement. By adopting a holistic silicon-to-system paradigm, Chen demonstrates how integrated design methodologies and cross-domain collaboration are essential to achieving reliable and scalable deployment of next-generation CPO architectures.

About the presenter
Yi-Hao Chen, Ph.D., is a principal engineer at Synopsys, where he leads technical innovation and customer success for Silicon Photonics and Co-Packaged Optics. Before his current role, Chen held technical positions at IBM Research, TSMC, and ASML, contributing to the development of silicon photonics, optical metrology, and EUV lithography.

He earned his doctorate in electrical engineering from the University of Michigan, Ann Arbor.