Presentation will begin: Thursday, January 12, 2023 - 1:15 PM EST
Presented by: Nikolaus Flöry, Vario-Optics
Miniaturized electro-optical systems are finding their way into an increasing number of applications. While photonic integrated circuits (PICs) and components are maturing, the integration and packaging remains a major bottleneck for high-volume production. This is particularly true as the complexity of chips advances, the number of optical I/Os grows, and the electrical requirements for PICs get tighter. Hybrid integration methods, such as the use of electro-optical circuit boards (EOCBs), are one solution to bridging this challenge.
Flöry discusses the basic concepts, opportunities, and challenges of electro-optical co-engineering and showcases examples of successful EOCB-based hybrid PIC packaging applications.
About the presenter
Nikolaus Flöry, Ph.D., is a business development manager at Vario-Optics, where he works on integrated photonics applications based on the company’s unique polymer waveguide platform. He holds a master’s degree in physics and a doctorate in optical sciences, both from ETH Zürich.