January 9 - 12, 2023 Online. FREE Registration.
Chroma Technology Corp.
Times are shown in:
Photonic Integrated Circuits
6:55 AM
Brett HeintzPROMOTED
Precision Automation Principles for the Optimal Testing and Packaging of PIC Devices
Brett Heintz (Aerotech, Inc.)
7:30 AM
Scott JordanGood News: Photonics Is Mainstream. Now We Must Scale.
Scott Jordan (PI (Physik Instrumente))
8:05 AM
Peter van ArkelThe IPSR-I Roadmap: Charting Future Challenges and Opportunities for Scaling Integrated Photonics
Peter van Arkel (Berenschot / IPSR-I roadmap)
8:40 AM
Kevin McComberA Proven, Portable, and PIC-Based Methodology for Cultivating a Next-Generation Workforce
Kevin McComber (Spark Photonics)
9:15 AM
Corrado SciancaleporeHow Is Silicon-on-Insulator Technology Fueling Growth in Silicon Photonics?
Corrado Sciancalepore (Soitec)
9:50 AM
Douwe GeuzebroekExpand Your Scope: Silicon Nitride Photonic Integrated Circuits
Douwe Geuzebroek (LioniX International)
10:25 AM
Michael GeiselmannHow Thick-Film SiN Is Driving PICs for Datacom, Lidar, Quantum, and Sensing
Michael Geiselmann (LIGENTEC)
11:00 AM
Hanjo RheeMichael LebbyMichael GeiselmannClaudia HoessbacherJose PozoPANEL DISCUSSION
Lessons Learned When Scaling PICs for Volume Production
Jose Pozo (Optica), Hanjo Rhee (Sicoya GmbH), Claudia Hoessbacher (Polariton Technologies), Michael Lebby (Lightwave Logic), Michael Geiselmann (LIGENTEC)
12:05 PM
Michael LebbyHow Electro-Optic Polymers Boost PIC Speed and Power Efficiency
Michael Lebby (Lightwave Logic)
12:40 PM
Tigers JonuziPhotonic Integrated Recurrent Neural Network Based on Frequency Multiplexing
Tigers Jonuzi (VLC Photonics)
1:15 PM
Nikolaus FlöryElectro-Optical Circuit Boards Bridge the PICs Gap
Nikolaus Flöry (Vario-Optics)
1:50 PM
Jorn SmeetsThe Importance of High-Quality PDKs and Collaboration in PIC Production
Jorn Smeets (PhotonDelta)
2:25 PM
Nicholas FahrenkopfPrototyping PICs for Applications Beyond Datacom
Nicholas Fahrenkopf (AIM Photonics)
3:00 PM
Tom MaderBridging the Challenge of Laser Integration via a Unified Design Kit and Fabrication Process
Tom Mader (OpenLight)
3:35 PM
Stefan PrebleExploring the Methods, Challenges, and Solutions for PIC Packaging
Stefan Preble (Rochester Institute of Technology)
4:10 PM
Torsten VahrenkampThe Growing PICs Sector’s Reliance on Automation and Wafer-Level Integration in Manufacturing
Torsten Vahrenkamp (ficonTEC)
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