January 9 - 12, 2023 Online. FREE Registration.
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Exploring the Methods, Challenges, and Solutions for PIC Packaging

Presentation will begin: Thursday, January 12, 2023 - 3:35 PM EST
Presented by: Stefan Preble, Rochester Institute of Technology

Packaging remains one of the most challenging aspects of PIC technology. Specifically, the integration of light sources and optical fibers into a package requires high-precision alignment and attachment that is costly and suffers from poor yields. Preble provides an overview of packaging photonic integrated circuit (PICs).

He details optical input and output in detail (including active and passive fiber attachment, and pluggable and flexible solutions) and a variety of solutions for realizing scalable manufacturing of PIC packages. In addition to achieving robust coupling of light, the PIC package must also realize electrical density and thermal management and meet reliability requirements.


About the presenter
Stefan PrebleStefan Preble, Ph.D., is professor at Rochester Institute of Technology and the director of the Microsystems Engineering doctorate program. His research is focused on integrated photonics for high performance computing, communications, and sensing systems. Preble earned a doctorate from Cornell University in electrical and computer engineering.




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