How PIC Testing Is Evolving to Meet Rapidly Advancing Applications

Test methods for photonic integrated circuits (PICs) are rapidly evolving specific probing solutions and measurement instrumentation frameworks to keep pace with the advancements in these devices. But there are speed bumps in the road ahead, such as the need for automation in die-level testing and for edge-coupling in wafer-level testing. The differences between the current and upcoming material platforms also present new test challenges, as well as the need to achieve complex measurements for component/circuit characterization. Further down the road, growing demand will accelerate testing to allow volume ramp up in emerging application markets. Artundo surveys these test and measurement challenges and discusses emerging solutions.

About the presenter
Iñigo Artundo, Ph.D., obtained a M.Sc. in telecom engineering at the Universidad Pública de Navarra in Pamplona, Spain, in 2005, and he received his doctorate in applied physics and photonics at the Vrije Universiteit Brussel in Brussels in 2009. Artundo has been involved in several national and European research projects and networks of excellence that focus on optical telecom and interconnects, micro-optics, and photonic integration. He has worked as a reviewer for several scientific journals and national and international funding agencies. Artundo holds specializations in business financing, commercial management and research, and strategic marketing. He is a member of IEEE, SPIE, and COIT.